Flyin’s Athermal AWG series products take silica-on-silicon planar technology and it is built with high performance and reliability, which can be used in general DWDM systems. Based on the athermal design and packing, it is totally passive product which does not require any electrical power or temperature control. For 50G AAWG Mux/Demux, it supports up to 96-CH based on a single chipset. Customized wavelengths, package and fiber options are also available.
Flyin Optronics’ 200GHz dense wavelength division multiplexer (DWDM) utilizes thin film coating technology and proprietary design of non-flux metal bonding micro optics packaging to achieve optical add and drop at the ITU wavelengths. It provides ITU channel center wavelength, low insertion loss, high channel isolation, wide pass band, low temperature sensitivity and epoxy free optical path . It can be used for wavelength add/drop in telecommunication network system.
Flyin Optronics’ Micro-Optical FWDM utilizes thin film coating technology and proprietary design of non-flux metal bonding micro optics packaging. It provides low insertion loss, high channel isolation, low temperature sensitivity and epoxy free optical path.
Flyin Optronics offers a full range of Thermal/Athermal AWG products, including 50GHz, 100GHz and 200GHz Thermal/Athermal AWG.Here we present the generic specification for the 40-channel 100GHz Flat Top Thermal AWG (40 channel TAWG) MUX/DEMUX component supplied for use in DWDM system.
Flyin’s Athermal AWG series products take silica-on-silicon planar technology and it is built with high performance and reliability, which can be used in general DWDM systems. Based on the athermal design and packing, it is totally passive product which does not require any electrical power or temperature control. For 50G AAWG Mux/Demux, it supports up to 96-CH based on a single chipset. Customized wavelengths, package and fiber options are also available.
Flyin Optronics’ 200GHz dense wavelength division multiplexer (DWDM) utilizes thin film coating technology and proprietary design of non-flux metal bonding micro optics packaging to achieve optical add and drop at the ITU wavelengths. It provides ITU channel center wavelength, low insertion loss, high channel isolation, wide pass band, low temperature sensitivity and epoxy free optical path . It can be used for wavelength add/drop in telecommunication network system.
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